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Equipment For Regenerating Sodium Persulfate And Recovering Copper From Microetching Waste Solution Using Diamond Anode Plate
The process of "direct electrolysis - regeneration adjustment" is used to regenerate the etching solution and recover copper. In the etching process of circuit boards, the concentration of copper ions in the etching solution will gradually increase, reducing the etching effect. To achieve the best etching effect, it is necessary to keep the copper ions (Cu2+), chloride ions (Cl-) and PH value in the etching solution within a reasonable and stable range. "Direct electrolysis" is the process of depositing high-purity electrolytic copper from alkaline etching waste solution, which reduces the copper ion concentration in the alkaline etching waste solution to 20~40g/L, resulting in its regeneration. "Regeneration adjustment" refers to the process of adding an appropriate amount of etching salt (ammonium chloride), liquid ammonia, and a small amount of alkaline etching additive to the regenerated etching solution with reduced the copper ion concentration to adjust the pH value and Cl- param- eter before it returns to the etching process line for use.
Specifications:
Equipment model | XFDM01 | XFDM02 | XFDM04 |
Equipment dimension (L×W×H, mm) | 1094 x 794 x 1844 | 1392 x 1247 x 2048 | 1900 x 1500 x 1850 |
Operating weight of equipment(kg) | 972 | 1947 | 650 |
Number of modules | 1-slot 2-module | 2-slot 4-module | 4-slot 8-module |
Anode material | BDD | ||
Cathode material | Ti | ||
Area of anode strip(㎡) | 0.88 | 1.75 | 3.5 |
Treatment capacity(m³/h) | By water quality | ||
Single-batch processing time(h) | By water quality | ||
Design circulating flow(m³/h) | 10 | 20 | 30 |
Head loss at design circulating flow(KPa) | 20 | 20 | 40 |
Installed power(Kw) | 10 | 20 | 40 |
Service power(Kw) | ≤7 | ≤12 | ≤20 |
Current density(mA/c㎡) | ≤70(≤301 A) | ≤70(≤602 A) | ≤70(≤1204 A) |
Maximum heating power(Kw) | 2.79 | 5.6 | 14 |
Input voltage | AC 380 V/50 Hz | AC 380 V/50 Hz | AC 380 V/50 Hz |
Power output | DC 500 A/20 V | DC 1000 A/20 V | DC 2000 A/20 V |
Operating ambient temperature | 0 ℃ ~ 40 ℃ | ||
Relative humidity | ≤90% | ||
Installation method | Indoor | ||
Circulating water pump | None | ||
Pressure protection | Optional | ||
Temperature protection | Optional | ||
Inlet diameter | DN50 flange | DN50 flange | DN80 flange |
Outlet diameter | DN50 flange | DN50 flange | DN80 flange |